Highly durable PCB carrier
Improving productivity in PCB component mounting
PROLEADER stably holds circuit boards during the processes of solder paste printing and component mounting. As its adhesiveness does not change greatly even after reflow soldering, circuit boards can also be removed easily with minimal stress on the boards and terminals. With reduced warpage of the boards after removal, PROLEADER contributes to production of highly reliable products.
PROLEADER uses a special adhesive material which does not dissolve at the soldering temperature, maintaining the initial adhesiveness. The base material is heat-resistant aluminum alloy which maintains flatness even after repeated use at a high temperature. These materials enable PROLEADER to be used repeatedly in the component mounting process which requires high precision.
As the adhesive layer of PROLEADER remains stable without dissolving at the soldering temperature, boards are barely subject to contamination by silicon. Accordingly, the problems with adhesiveness in the post-process such as the repelling of adhesive agents are reduced.
The adhesive layer is resistant to various chemicals like organic solvents. Even if materials such as flux, which are difficult to remove, adhere to the adhesive layer in the soldering process, the layer can be washed clean.
Custom processing (size change, hole drilling) is available upon customer's request. Please feel free to contact us.
|PROLEADER AL 100 （PAL100）||Aluminum alloy||300 mm × 500 mm||Base thickness: 1.5 mm
Product thickness: 1.6 mm
|PROLEADER AL 200 （PAL200）|
|RPROLEADER AL 300 （PAL300）|