Photoresists
The photoresist product line encompasses a wide range of applications including broadband, g-line, i-line, 248nm, 193nm (dry and immersion), e-beam and EUV technology. The portfolio also includes a unique negative tone development resist system to address next generation needs, including double patterning.
Wide array of high resolution imaging systems for 193 nm exposure including positive dry and immersion imaging and negative tone development (NTD)
GKR series are positive tone KrF photoresist systems that cover a wide range of applications.
Extensive series of mid-uv sensitive photoresists for critical to non-critical applications encompassing sub-0.30µm to >1.0µm resolution on varied substrates over a large range of resist thickness.
Multiple series of negative tone, polyisoprene-based resist systems applicable to a broad range projection, proximity and contact imaging and wet etch needs on varied substrates
Positive and negative tone resist series for a wide array of e-beam imaging applications
Photoresist Ancillaries
A wide range of wet chemistries for the lithographic process
We offer a wide range of chemistries for the lithographic process including pre-wet, edge bead removal, cup rinse, development, photoresist stripping, removal and rinse
FUJIFILM Electronic Materials provides a comprehensive range of metal ion free (MIF) photoresist developers suitable for immersion and in-line track development.
Solvents for edge bead removal, pre-wet & other applications
FUJIFILM’s proprietary Microstrip® family of photoresist strippers provides processing choices and performance advantages over current industry standards for both Aluminum & Copper technology.
High Purity Primary Solvents
A leading manufacturer of high purity solvents used in semiconductor-related manufacturing processes
There are many advantages to working with FUJIFILM Ultra Pure Solutions, Inc. Our people have extensive knowledge and expertise to provide products to your exact specifications, when and where you need them, every time.
Cleaners and Etchants
A comprehensive range of specialty etchants, cleaners, removers and other ancillary products designed to compliment the FUJIFILM Electronic Materials photoresist and polyimide product lines.
Highly effective aqueous post ash residue cleaners for both Al/SiO2 and Cu/low-k BEOL processes
We offer a broad range of diluted Hydrofluoric (HF) ratios, specialty Buffered Oxide Etchants (BOE) - with/without surfactant, Mixed Acid etchants (MAE) & specialty metal etchants
CVD Precursors
A full range of ultra-pure CVD and thin film chemicals as well as high purity delivery systems designed to provide cost saving solutions and next generation technologies to the semiconductor industry.
We can review hazards and regulatory issues, purify, package, test, and provide R&D samples within weeks. FUJIFILM focuses on advanced purification, package compatibility, stability, analysis, and delivery of advanced chemicals.
FUJIFILM has chemical expertise in purification, package compatibility, stability, and delivery of advanced chemicals.
High purity dielectric chemicals supported by state of the art production and analytical testing.
CMP slurry & PCMP cleaner
To polish and planarize complex layers of integrated circuits
- High removal rates, high planarization efficiency, low topography, low defectivity, and excellent over polish margins
- Tunable formulations – with independent component knobs for customer’s specific performance targets
- High selectivity to common barrier films resulting in easy end-point detection and good Cu residual clearing without compromising topography
- Strong Prestonian behavior in Cu polishing for easy process development and control
- Low cost of ownership due to highly concentrated formulations
- Ease of use – Special cleaning chemistries or process conditions are not required
- Outstanding corrosion protection for sensitive copper features and very low defectivity
- Suitability for a wide range of integration schemes including low-K and ULK dielectrics, etch hard masks, and ARC layers
- Fast removal of conventional barrier films and Co liner film
- Independent component knobs for film selectivity tuning and customization, resulting in excellent final topography correction and surface finish
- Attractive cost of ownership – Concentrated formulations available to provide lower cost at point-of-use
- Outstanding corrosion protection for sensitive cobalt features
- Compatibility with a wide range of integration schemes including varies dielectrics, etch hard masks, and ARC layers
- Tunable selectivity to meet customized film stacking and final finishing targets
- Attractive cost of ownership – Concentrated formulations available to provide lower cost at point-of-use
FUJIFILM Electronic Materials Front End CMP slurries are designed for devices that utilize advanced transistor technologies such as high-K metal gates, advanced dielectrics, 3-dimensional FinFET transistors, and self-aligned contacts. Various product platforms are available to meet a broad range of process and technology requirements.
- Multiple platforms with different baseline material removal selectivities
- Tunable selectivities within each platform
- Exceptionally low defectivity by design
- Competitive cost of ownership
FUJIFILM Electronic Materials Post CMP slurries are designed to clean particles, trace metal and organic residues while protecting the metal surface.
Market-leading cleaner are available to meet a broad range process and technology requirements.
- Efficient particle removal
- Excellent organic cleanability
- Outstanding corrosion protection for sensitive metal features
- Attractive cost of ownership – Concentrated cleaners provide lower cost at point-of-use
Available Copper Cleaner : Clean-100
Contact Us for more information and a complete product overview
Wave Control Mosaic (Color Resist)
Color Mosaic for on-chip color filters image sensors and other optical applications.
Our COLOR MOSAIC is designed for high-end, high-resolution image sensor and for low temp process applications
Our COLOR MOSAIC is designed for high-end, high-resolution image sensor applications
Highly resolution and transparent materials for image sensor (IS) and planar layer applications
Highly OD and resolution light shielding materials for image sensor (IS) and black matrix applications
IR cut and IR pass resists for applications from facial recognition for biometrics to LIDAR for automotive, with the potential to integrate into RGB color filter arrays.
Low / High refractive index material for image sensor (IS) applications
Ancillaries
FUJIFILM offers optimized developers, edge bead removers, backside rinse for our COLOR MOSAIC process
FUJIFILM offers extra thin film capability adhesion promoter for COLOR MOSAIC with a better adhesion on the substrate
Polyimide and PBO
Materials for stress relief buffer coat or redistribution layer (RDL)
FUJIFILM's chemically amplified PBO products offer high reliability with low cost of ownership.
- High contrast, positive acting materials based on PBO chemistry
- Photo-imageable using g-line, i-line or broadband exposure tools
- Very low viscosity for decreased dispense volume
- Excellent mechanical properties for high reliability
- Fast photospeed and low dark film loss for high throughput
- NMP free
FUJIFILM’s solvent developable polyimides are a family of photo-imageable polyimide precursors, covering both high and low cure temperatures for edistribution layer (RDL) and buffer coat applications.
- Negative acting, solvent developable polyimides
- Photo-imageable using g-line and/or i-line exposure tools
- Low or high temperature cure options
- Fast photospeed for high throughput
- Excellent mechanical properties for high reliability
- NMP free offerings for both high and low temperature cure
FUJIFILM has several non-photosensitive polyimide formulations for a wide variety of semiconductor and related applications.
- Wide coating thicknesses range
- Low temperature cure options
- Very low shrinkage
- Patternable using laser direct or etch methods
- NMP free
FUJIFILM offers optimized developers, edge bead removers, backside rinse for our Polyimides and PBO products.
FUJIFILM offers adhesion promoter for our Polyimide and PBO's with a better adhesion on the substrate