In LCD panel production, ACF (anisotropic conductive film) is used to attach the driver IC by holding the part under pressure and applying heat via the bonding tool. If heat is unevenly distributed across the bonding surface (i.e., hotter in some places and cooler in others), the ACF may not bond properly, rendering the product defective. Thermoscale provides an easy-to-read visual map for evaluating the uniformity or the suitability of heat distribution.
Heat sealers are commonly used to seal packages for foodstuffs, medical supplies and products such as Li-ion batteries. A heater block applies strong heat to the end of the package to seal the plastic. If heat is distributed unevenly across the heat seal surface or the heater block, or if the packaging is not heated sufficiently, the seal may not be formed properly. Thermoscale can be used to evaluate the quantity of heat applied to the package.
