This is a collection of examples of semiconductor.
Five examples of CMP polishing, Backgrind tape lamination roller, Suction jig for die bonding, Wafer bonding equipment thermocompression bonds and Vacuum heat pressure devices are posted.
Table of contents
Industry: Semiconductor production
Challenges: Insufficient accuracy or defective products occur frequently because the production continues despite unresolved instances of poor polishing or other issues including inadequate contact precision.
Benefits of Prescale: Quality improve, Time saving
Industry: Semiconductor Production
Challenges: If the lamination roller pressure distribution is not uniform, the backgrind tape can become wrinkled.
Benefits of Prescale: Time saving, Quality improvement
Industry: Semiconductor manufacturing (die bonding)
Challenges: It the suction nozzle is not applied evenly to the semiconductor chips, problems may occur when the chips are removed, or the chips may become flawed.
Benefits of Prescale: Reduce of low quality product loss, Material loss
Industry: Manufacturing (e.g., Bonding equipment, MEMS, Silicon wafers, Compound semiconductors, CMOS image sensors)
Challenges: If the pressure applied to bond the wafers or substrates is not constant, problems such as defective sealing, uneven bonding strength, and pattern width unveness may occur.
Benefits of Prescale: Reduce the adjustment time and effort for investigating the cause
Industry: Electronic components, OLEDs, Touchscreens, Print circuit boards, Equipment such as semiconductors that are used as manufacturing and development machines
Challenges: The devices are expected or required to maintain as uniform surface pressure as long as possible to improve the quality of processed products.
Benefits of Prescale: Reduce of pressure failure or yield, Quality improvement