Polyimides PBOs non-photosensitive


Materials for low shrinkage, low temperature and lift off applications

Fujifilm has several non-photosensitive polyimide formulations for a wide variety of semiconductor and related applications.

  • Final coating thicknesses from 400 Angstroms to 25 microns
  • Low temperature cure options
  • Very low shrinkage
  • Patternable using laser direct or etch methods
  • NMP free

Product Summary

  • Durimide® 20 Series: Fully imidized polyimide used primarily as a thin lift-off layer. Durimide 20 is stable at room temperature. Final thicknesses from 400 Angstroms to 3 microns possible
  • LTG 12-52: Low temperature glue designed for die and component attach applications.Final thicknesses from 5 to 25 microns.