Fujifilm has several non-photosensitive polyimide formulations for a wide variety of semiconductor and related applications.
- Durimide™ 32A
- Fully imidized polyimide used primarily as junction coating, passivation and alignment layer. Low shrinkage and cure temperature, reworkable and solvent soluble
- Durimide™ 116A
- Non-photosensitive polyamic acid formulation, photo-imaged using a positive photoresist, TMAH developable, 4-10μm cured film thickness.
- LTG 12-52
- Low temperature glue designed for die and component attach applications. Final thicknesses from 5 to 25 microns.
- NMP free
- Final coating thicknesses from 1 to 25 microns
- Low temperature cure options
- Very low shrinkage
- Patternable using laser direct imaging or etch methods
- * "Durimide™ " is a trademark of FUJIFILM CORPORATION, registered in the United States and other countries and regions.