|Automobiles||Semiconductors||Printed Circuit Boards||Electronics|
|Flat Panel Displays||Fuel (PV/FC/LiB)||Packaging (Food/Pharmaceutical)||Highly functional films||Others|
- Verifying CMP polishing head contact uniformity
- Verifying backgrind tape lamination pressure uniformity
- To reduce mistakes when removing and transporting chips in die bonding
- To ensure high-quality thermocompression bonding by the application of uniform pressure
Please contact us to be referred to the appropriate Distributor of PRESCALE for your region.