Automobiles Semiconductors Printed Circuit Boards Electronics
Flat Panel Displays Fuel (PV/FC/LiB) Packaging (Food/Pharmaceutical) Highly functional films Others

Semiconductors

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Applications:CMP Polishing Head Request Application Examples

Uses

  • Verifying CMP polishing head contact uniformity
Measurement Results
graph
Applications:Backgrind Tape Lamination Roller Request Application Examples

Uses

  • Verifying backgrind tape lamination pressure uniformity
Measurement Results
graph
Applications:Suction Jig For Die Bonding Request Application Examples

Uses

  • To reduce mistakes when removing and transporting chips in die bonding
Measurement Results
graph
Applications:Wafer bonding equipment Thermocompression bonds Request Application Examples

Uses

  • To ensure high-quality thermocompression bonding by the application of uniform pressure
Measurement Results
graph

By selecting the checkboxes of the application examples you would like to view, you can download multiple examples at one time.

Download Applicatiosn for Semiconductors

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