Fujifilm Participates in “SEMICON Taiwan 2025”

TOKYO, September 3, 2025 – FUJIFILM Corporation will participate in “SEMICON Taiwan 2025”, an international exhibition of semiconductor manufacturing equipment and materials, to be held in Taipei, Taiwan, from September 10 to 12, 2025.

Fujifilm has identified Taiwan as one of the world's most rapidly growing and most advanced semiconductor markets. To strengthen customer support capabilities, the company is expanding local production and quality assurance systems. Fujifilm is currently constructing a new factory in Hsinchu, Taiwan, to manufacture cutting-edge semiconductor materials. This initiative aims to meet the growing demand in the Taiwan market and contribute to the stabilization of the global semiconductor supply chain. The new factory is scheduled to start operations by the end of 2026.

At SEMICON Taiwan, Fujifilm will introduce a wide range of semiconductor materials used in wafer processing to post processing in semiconductor manufacturing including photoresists^*1, photolithography-related materials^*2, CMP slurries^*3, post-CMP cleaners^*4, polyimides^*5 for post processing and heat dissipation material. Furthermore, Fujifilm will present its product development capabilities and robust service system tailored to the needs of advanced semiconductor manufacturing in Taiwan, further deepening collaboration with local customers.

Fujifilm remains committed to local investment and technological development, accelerating the delivery of one-stop solutions that meet the diverse needs of its customers, and contributing to the further development of Taiwan's semiconductor industry.

• *1 Material used to coat wafer substrate when circuit patterns are drawn in the process of semiconductor manufacturing.
• *2 Development solutions, cleaners and other materials used in the photolithography process of semiconductor manufacturing.
• *3 A proprietary formulation containing an abrasive that uniformly planarizes semiconductor surface, which contains a mixture of wires and insulation films of varying hardness.
• *4 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface.
• *5 A material with strong heat resistance and insulation properties, used for forming semiconductors’ protective films and redistribution layer.

• * Please note that the contents including the product availability, specification, prices and contacts in this website are current as of the date of the press announcement and may be subject to change without prior notice.