Fujifilm Launches Advanced Packaging CMP Slurry

TOKYO, September 29, 2025 – FUJIFILM Corporation announced the launch of CMP slurry^*1 for advanced packaging, enabling the integration of multiple semiconductor chips into a single package. This product has been adopted by a major semiconductor device manufacturer as an essential abrasive for planarizing bonding surfaces in hybrid bonding^*2, one of the advanced packaging technologies key to enhancing AI semiconductor performance.

CMP slurry is a polishing material used in semiconductor manufacturing to planarize wafer surfaces. As semiconductor devices become increasingly miniaturized and multilayered, the need for even greater wafer flatness has grown, making CMP slurry indispensable in the manufacturing process. The required precision is so high that, if the area of a 300mm wafer were compared to the size of Tokyo’s 23 wards, an urban area covering approximately 627 square kilometers, roughly equivalent to the size of Chicago, all surface irregularities would need to be leveled to within a 1mm margin of error across the entire area. While CMP slurry is primarily used in the front-end process of semiconductor manufacturing, its application in advanced packaging processes–where multiple chips are bonded together–has been increasing in recent years.
Fujifilm manufactures CMP slurry at production sites in Arizona, USA, Hsinchu and Tainan of Taiwan, Cheonan, South Korea, and Kumamoto, Japan, and plans to begin operations at a new facility in Zwijndrecht, Belgium in spring 2026. By producing near customers and supporting them locally in development, production, and quality management, Fujifilm maintains a high global market share in CMP slurry. In particular, Fujifilm holds the world’s top share in copper interconnect CMP slurry, which is used in advanced semiconductor manufacturing and is expected to see significant growth. Fujifilm’s copper interconnect CMP slurry achieves high polishing efficiency and planarization performance through proprietary formulation technologies for additives that enhance wafer surface polishability, corrosion inhibitors that prevent copper oxidation after polishing, and dispersing technology that stably disperses abrasive particles at high concentrations.

The newly launched product is an evolution of Fujifilm’s front-end copper interconnect CMP slurry, optimized for advanced packaging. The formulation of additives, corrosion inhibitors, and abrasives has been refined to achieve high-precision planarization of hybrid bonding surfaces, where copper and oxide films coexist.
Going forward, Fujifilm will expand this product to various advanced packaging materials, such as redistribution layers and micro-bumps^*3. Fujifilm will also continue to advance its CMP slurry technology for front-end semiconductor manufacturing, contributing to further device miniaturization.

Fujifilm is a global supplier of photoresists^*4, photolithography-related materials^*5, CMP slurries, post-CMP cleaners^*6, thin-film chemicals^*7, polyimides^*8, high-purity process chemicals^*9, and other process materials for semiconductor manufacturing from front-end to back-end processes. Fujifilm is also expanding globally with products such as WAVE CONTROL MOSAIC^™*10, which includes color filter materials for image sensors.
Fujifilm will continue to contribute to the development of the semiconductor industry by providing one-stop solutions to solve customers' issues through its broad product lineup that covers nearly all areas of the semiconductor manufacturing process, from cutting-edge to legacy nodes. The company also leverages its global stable supply system with manufacturing bases in major countries including Japan, the United States, Europe and other key locations across Asia, along with its advanced research and development capabilities.

• *1 A proprietary formulation containing an abrasive that uniformly planarizes semiconductor surface, which contains a mixture of wires and insulation films of varying hardness.
• *2 .An advanced packaging technology for directly bonding chips or wafers.
• *3 Fine protruding terminals, several to tens of micrometers in diameter, used for high-density connections between semiconductor chips or between chips and substrates, shortening the wiring between chips and substrates contributes to faster signal transmission and improved heat dissipation.
• *4 Material used to coat wafer substrate when circuit patterns are drawn in the process of semiconductor manufacturing.
• *5 Development solutions, cleaners and other materials used in the photolithography process of semiconductor manufacturing.
• *6 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface.
• *7 Materials for forming low-dielectric insulation films.
• *8 A material with strong heat resistance and insulation properties, used for forming semiconductors’ protective films and rewiring layer.
• *9 High-purity chemicals used in the cleaning and drying processes. The chemicals are employed to remove contaminants during the cleaning and drying stages of semiconductor manufacturing, as well as to eliminate metals and oils during the etching process.
• *10 General term referring to a group of functional materials for controlling electromagnetic light waves in a broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones. WAVE CONTROL MOSAIC is a registered trademark or trademark of FUJIFILM Corporation.

• * Please note that the contents including the product availability, specification, prices and contacts in this website are current as of the date of the press announcement and may be subject to change without prior notice.