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An image of a wafer, a semiconductor material that is illuminated by multiple lights.

EUV (13.5nm) - Applications

EUV materials for negative tone imaging

History of pattern shrinkage for lithography
Pattern shrinkage and light source

Pattern shrinkage has been driven by shorter exposure wave length.

Pattern view
Advantage of FUJIFILM NTI process - PAG connected PDQ (PCP)

By employing PCP, we were able to achieve a significant reduction in LWR of 17%.

Advantage of FUJIFILM NTI process - NEW developer DP819A

New developer, DP819A was born to achieve impressive resolution with EUV exposure.