SEMICON JAPAN 2025

Enabling the semiconductor
evolution.

FUJIFILM-shaping
the future with materials.

FUJIFILM will be exhibiting at SEMICON JAPAN 2025.

Concept Video

Event Overview

SEMICON JAPAN 2025

Tokyo Big Sight East Halls

Talk Overview

Next-Generation Semiconductor Manufacturing driven by the Cutting-Edge Materials with AI Co-Creation

  • Fujifilm develop “one-stop solution” strategy, providing all customers a wide range of advanced materials and technical support across virtually all manufacturing processes, not only front-end but also back-end. This presentation will cover our unique business strategy, key product features, examples of AI collaboration model with customers and partners, and contributions to next-generation semiconductor manufacturing through ultra-advanced materials.
  • Date & Time:December17(Wed) 16:00–16:30
  • Venue:SuperTHEATER (West Hall 4)
  • Tetsuya Iwasaki
    Director, Senior Corporate Vice President
    General Manager of
    Electronic Materials Business Division
    Global President of
    FUJIFILM Electronic Materials

Exhibition Booth Overview

What “One-Stop Solution”
Means

  1. 1.Developing and supplying end to end materials
    across the entire semiconductor
    manufacturing process.

    Delivering integrated solutions to
    complex customer challenges
    that can’t be solved by any single material alone.
    Offering materials optimized for multiple
    adjacent processes, all in one package.

  2. 2.Providing optimal materials
    for every type of semiconductor.

To every challenge— a solution.
Our comprehensive product lineup covers vitually every manufacturing process. Photo lithography Mask fabrication Resist Coating & Exposure Development Etching Cleaning Drying Polishing Cleaning Insulating Film Formation Packaging Processes Cleaning Drying World’s No.1 Share Image Sensor Materials Color filter materials Wave Control Mosaic

A Global Network
Close to Every Customer

A global network of production and R&D sites
Promoting next-generation process technology
and co-development of new products
with our customers.
Through a “local production for local consumption, local support”
framework,
we deliver solutions
precisely aligned with customer needs.

Supply Chain Resilience Mitigating geopolitical risks Strengthening business continuity (BCP) On-Site Support Rapid identification of customer needs Troubleshooting Multilingual technical support

Product introduction

FFEM offers a wide product lineup covering
wafer processing to
advanced packaging
applications.

[Development of Current Products]

Leading the global CMP market with the best total
solution,
powered by expertise in polishing and cleaning.

  • ・CMP Slurry
  • ・pCMP Cleaner
  • ・CMP for Hybrid Bonding
  • ・CMP for Back End process

The Color Filter Materials with the world's largest market share for Image Sensors :
Go Beyond the
Limit of high Resolution, good Color Reproduction by New Technologies.

  • ・High Performance and High Quality Polyimide material, Resilient Supply Chain with Multiple Production Sites
  • ・Liquid Type Polyimide : Low Temperature Cure, High Resolution, Good Mechanical Properties, Low Shrinkage, High Reliability
  • ・Film Type Polyimide：Achieving an Excellent Planarity with Film Laminating Process

EUV NTD Resist Enabling High Resolution

  • ・EUV Resist
  • ・EUV Negative Tone Development System
[Solving Social Issues：Reducing Environmental Impact]

PFAS-Free Advanced Resist

  • ・ArF

Heat Dissipation Materials

  • ・TIM (Thermal Conductive Sheet Containing Copper Nanowire Fillers)

Nanoimprint Technology Enabling
nano-patterning with Low Energy consumption

  • ・Nanoimprint Lithography Technology
[Digital × Materials]
  • ・Co-creation development utilizing materials informatics and generative AI

Contact

Media Contact

FUJIFILM Holdings Corporation
Corporate Communications Division,
Public Relations Group

TEL：+81-3-6271-2000

Business Contact

FUJIFILM Corporation
Electronic Materials Business Division

E-mail：shm-ff-em_inquiries@fujifilm.com