Polyimides and PBO's | Fujifilm [India]

Polyimide and Polybenzoxazole (PBO) products are specialty stress relief coatings used as a protective layer or "buffer coat" before packaging or redistribution layer (RDL).

Buffer coat layers provide protection to the finished die during back grind, singulation and assembly processing resulting in improved packaged yields and increased reliability lifetime performance. Redistribution layer applications enable the most advanced packaging designs.

Product Selection Guide

When selecting a product, first confirm whether it is a positive-type water-based development type or a negative-type solvent development PFAS-free type. For positive-type water-based development types, select from FB5610-07, B5610, FB5610-12, or FB5610-15 based on the cured thickness. For negative-type solvent-based development with PFAS-free type, verify the dielectric requirements, confirm the cured thickness range and choose LTC9310-E19 and LTC9320-E19. If neither applies, consult FFEM.

Product Lineup

Photosensitive - Aqueous Developable

PBO based products designed and optimized for buffer coat and RDL

Photosensitive - Solvent Developable

Designed for thick film capability, robust processing and with excellent mechanical properties

Non-Photosensitive

Materials for low shrinkage, low temperature and lift off applications

Ancillaries

Additional ancillary chemicals for use with our polyimide and PBO products