Fujifilm Develops the World’s First Fluorine-Free^*1 Negative ArF Immersion Resist

TOKYO, April 23, 2026 – FUJIFILM Corporation today announced that it has developed, for the first time in the world, a fluorine-free negative ArF immersion photoresist^*2 as a material developed with environmental considerations in mind used in advanced semiconductor manufacturing processes. The newly developed fluorine-free ArF immersion photoresist is a negative-tone photoresist specifically designed for ArF immersion lithography^*3 and is compatible with advanced nodes used in the manufacturing of AI semiconductors, for which demand continues to grow. Fujifilm has begun providing samples of the new photoresist to customers and aims for early commercialization following customer evaluations.

Photoresists for ArF immersion lithography, which is currently the most widely used advanced lithography technology, typically contain PFAS^*4. These substances are used to efficiently promote acid reactions required for fine circuit pattern formation and to impart water repellency to the resist surface in order to suppress defects caused by residual water^*5 on wafers. However, due to concerns regarding potential impacts on the environment and ecosystems, regulatory efforts to restrict the use of PFAS have been progressing.
Fujifilm has proactively worked to voluntarily reduce and replace substances that raise concerns regarding potential adverse effects on human health and the environment. As part of these efforts, the company previously developed the world’s first NTI developer^*6 using high-purity organic solvents with high safety profiles. In addition, Fujifilm launched a PFAS-free nanoimprint resist in April 2024 that is compatible with nanoimprint lithography, and in July 2025 developed a PFAS-free negative ArF immersion photoresist.

In recent years, interest has expanded beyond PFAS to include organic compounds containing carbon–fluorine bonds more broadly, which are difficult to degrade in the natural environment. Consequently, demand has been increasing for new materials that do not use fluorine-containing raw materials.
In semiconductor manufacturing processes, wastewater containing fluorine compounds must be managed separately from non-fluorinated wastewater. Furthermore, the treatment of fluorine-containing wastewater requires high-temperature energy. By eliminating fluorine-containing compounds from photoresist raw materials, improved efficiency in wastewater management and reductions in the energy required for wastewater treatment can be expected.

In response to the growing demand for fluorine-free materials, Fujifilm has developed a negative ArF immersion photoresist that does not use fluorine-containing raw materials, not limited to PFAS. This photoresist was developed by leveraging functional molecule design technologies cultivated through Fujifilm’s photographic film research and development, together with molecular design, organic synthesis, formulation, and analytical technologies accumulated through the development of semiconductor materials such as photoresists. Although fluorine-containing compounds are generally considered indispensable in photoresist formulations, the newly developed resist achieves excellent acid reaction efficiency during circuit pattern formation and high water repellency that reduces residual water during advanced ArF immersion exposure—without the use of fluorine-containing raw materials—thereby enabling the formation of fine circuit patterns with minimal variation.

Going forward, Fujifilm plans to apply its fluorine-free resist technologies and know-how to other advanced photoresists, including those for EUV lithography, to further promote fluorine-free solutions for advanced semiconductor manufacturing.

Fujifilm offers a wide range of materials used throughout the entire semiconductor manufacturing process, from front-end to back-end. These materials include photoresists, photolithography-related materials^*7, CMP slurries^*8, post-CMP cleaners^*9, thin-film materials^*10, photosensitive insulating materials such as polyimides^*11 under the ZEMATES^™*12 brand, and high-purity process chemicals^*13. Fujifilm also provides Wave Control Mosaic^™*14, a group of functional materials including color filter materials for image sensors. With an extensive portfolio covering semiconductor manufacturing processes from leading-edge to legacy nodes, Fujifilm maintains a global supply chain with manufacturing and research and development sites in Asia, the United States, and Europe. By providing a one-stop solution to address customer needs, the company contributes to the advancement of the semiconductor industry.

For further information on Fujifilm’s sustainability-related initiatives, click here.

• *1 Fluorine-free means that organic compounds containing carbon–fluorine bonds, including perfluoroalkyl compounds and polyfluoroalkyl compounds, are not used as raw materials.
• *2 Photosensitive material used to coat a wafer substrate when circuit patterns are drawn using photochemical reactions in the process of semiconductor manufacturing.
• *3 An exposure method using ArF (argon fluoride) excimer laser light (wavelength 193 nm), which is currently the most widely used advanced lithography technology.
• *4 PFAS refers to a collective term for perfluoroalkyl compounds, polyfluoroalkyl compounds, and their salts, as defined in the OECD's 2021 report “Reconciling Terminology of the Universe of Per- and Polyfluoroalkyl Substances: Recommendations and Practical Guidance.” Accordingly, the claim ‘PFAS-Free’ denotes the absence of substances falling within this defined group.
• *5 The occurrence of water droplets remaining on the wafer. This can lead to penetration into the resist film or the dissolution of resist material, potentially causing defects.
• *6 Negative Tone Imaging (NTI) developer. It is used in the negative development process where the unexposed areas are removed by the developer after exposure to create the circuit pattern.
• *7 Development solutions, cleaners and other materials used in the photolithography process of semiconductor manufacturing.
• *8 A proprietary formulation containing an abrasive that uniformly planarizes semiconductor surface, which contains a mixture of wires and insulation films of varying hardness.
• *9 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface.
• *10 Materials for forming low-dielectric insulation films.
• *11 A material with strong heat resistance and insulation properties, used for forming semiconductors’ protective films and rewiring layer.
• *12 ZEMATES is a registered trademark or trademark of FUJIFILM Corporation.
• *13 High-purity chemicals used in the cleaning and drying processes. The chemicals are employed to remove contaminants during the cleaning and drying stages of semiconductor manufacturing, as well as to eliminate metals and oils during the etching process.
• *14 General term referring to a group of functional materials for controlling electromagnetic light waves in a broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones. WAVE CONTROL MOSAIC is a registered trademark or trademark of FUJIFILM Corporation.

• * Please note that the contents including the product availability, specification, prices and contacts in this website are current as of the date of the press announcement and may be subject to change without prior notice.