Fujifilm presents latest advanced packaging research results and will introduce PFAS-free PBO at ECTC 2026 

Tokyo, Japan and Rhode Island, USA – May 21, 2026 -- FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES™^*1 product line of photosensitive insulating materials, including PFAS-free^*2 PBO, at the Electronic Components and Technology Conference 2026 (ECTC 2026), May 26–29, 2026, in Orlando, Florida.

As part of the conference’s technical program, Fujifilm will present the results of joint research conducted with imec, a leading international research institute for nanoelectronics and advanced semiconductor technologies. In addition, FUJIFILM Electronic Materials U.S.A., Inc., the company’s U.S.-based semiconductor materials subsidiary, will exhibit at the conference (Booth #1003).

ECTC is the world’s largest international conference dedicated to semiconductor packaging technologies, bringing together more than 2,500 scientists, engineers, and business leaders from across the global semiconductor ecosystem.

“Fujifilm’s new PFAS-free PBO product shows Fujifilm’s ongoing commitment to sustainability and the environment,” said Heather Mazjanis, vice president, Photopolymers, GBD Core Photoresists and PBO at FUJIFILM Electronic Materials, U.S.A., Inc. “Fujifilm is also promoting PFAS-free photoresists used in various advanced technologies, further supporting  responsible innovation.”

Fujifilm’s technical presentations will focus on bonding technologies and interconnect formation technologies that enable further miniaturization of advanced packages, including 2.xD and 3D architectures and high-bandwidth memory (HBM).

Fujifilm and imec have jointly developed a Sn damascene bonding process that enables further miniaturization of microbumps, expanding available bonding solutions beyond hybrid bonding approaches. The presentation will include lithography and polishing evaluation results using Fujifilm materials.

In collaboration with imec, Fujifilm has contributed to the development of a damascene copper interconnect process capable of forming 1.0-micrometer line-and-space patterns. This presentation will be delivered by imec, with Fujifilm participating as a co-author.

 The ZEMATES™ product lineup consists of liquid-type polyimide for redistribution layers (RDL)^*3 and protective films, film-type polyimide for redistribution layers and PBO (polybenzoxazole)^*4 for use in protective films. These products are used as insulating layer materials in semiconductor packaging processes, covering a wide range from power semiconductors to high-performance AI. 
 In response to increasing regulatory and customer interest in PFAS-free materials, Fujifilm has developed PFAS-free PBO formulations that do not rely on PFAS-containing raw materials.
By leveraging Fujifilm’s long-standing expertise in molecular design, formulation, and analysis, rooted in both photographic film technology and semiconductor materials development, the company has achieved PFAS-free PBO materials while maintaining patterning performance and mechanical properties comparable to conventional products. Customer evaluations are currently underway at multiple sites, with aims for commercialization in 2026.

At its exhibition booth (#1003), FUJIFILM Electronic Materials U.S.A., Inc. will showcase a range of materials for advanced semiconductor packaging, including:

• Polybenzoxazole (PBO) dielectric insulating films, including newly developed formulations designed to meet increasing demand for PFAS-free materials
• Polyimide materials, available in both liquid and film formats
• Thermal management materials, such as heat dissipation sheets
• CMP slurries and related back end process materials used in advanced semiconductor manufacturing

Fujifilm offers a wide range of materials used throughout the entire semiconductor manufacturing process, from front-end to back-end. These materials include photoresists^*5, photolithography-related materials^*6, CMP slurries^*7, post-CMP cleaners^*8, thin-film materials^*9 photosensitive insulating materials such as polyimides under the ZEMATES™ brand, and high-purity process chemicals^*10. Fujifilm also provides Wave Control Mosaic™^*11", a group of functional materials including color filter materials for image sensors. With an extensive portfolio covering semiconductor manufacturing processes from leading-edge to legacy nodes, Fujifilm maintains a global supply chain with manufacturing and research and development sites in Asia, the United States, and Europe. By providing a one-stop solution to address customer needs, the company contributes to the advancement of the semiconductor industry.

• *1 ZEMATES™ is a registered trademark or trademark of FUJIFILM Corporation.
• *2 PFAS refers to a collective term for perfluoroalkyl compounds, polyfluoroalkyl compounds, and their salts, as defined in the OECD's 2021 report “Reconciling Terminology of the Universe of Per- and Polyfluoroalkyl Substances: Recommendations and Practical Guidance.” Accordingly, the claim ‘PFAS-Free’ denotes the absence of substances falling within this defined group.
• *3 Wiring layer connecting small terminals of semiconductor chips to external circuits, composed of metal wiring and insulating layers. RDL stands for Redistribution Layer.
• *4 Material with high heat resistance and insulation, used for protective films and redistribution layers in semiconductors, and offering superior heat resistance and strength similar to polyimide.
• *5 Photosensitive material used to coat a wafer substrate when circuit patterns are drawn using photochemical reactions in the process of semiconductor manufacturing.
• *6 Development solutions, cleaners and other materials used in the photolithography process of semiconductor manufacturing.
• *7 A proprietary formulation containing an abrasive that uniformly planarizes semiconductor surface, which 
  contains a mixture of wires and insulation films of varying hardness.
• *8 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface.
• *9 Materials for forming low-dielectric insulation films.
• *10 High-purity chemicals used in the cleaning and drying processes. The chemicals are employed to remove contaminants during the cleaning and drying stages of semiconductor manufacturing, as well as to eliminate metals and oils during the etching process.
• *11 General term referring to a group of functional materials for controlling electromagnetic light waves in a  broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones. WAVE CONTROL MOSAIC™ is a registered trademark or trademark of FUJIFILM Corporation. 

• * Please note that the contents including the product availability, specification, prices and contacts in this website are current as of the date of the press announcement and may be subject to change without prior notice.