Fujifilm Receives Excellence Award at “Semiconductor of the Year 2026” for PFAS-Free Negative-Type ArF Immersion Photoresist

TOKYO, May 21, 2026 – FUJIFILM Corporation today announced that it has been honored with the Excellence Award in the Semiconductor Electronic Materials category at the 32^nd Semiconductor of the Year 2026, organized by Sangyo Times, for its PFAS-Free^*1 negative-type ArF immersion photoresist^*2.
Semiconductor of the Year recognized products that have made significant contributions to the advancement of cutting-edge electronics. Winners are selected through voting by reporters of the Electronic Device Industry News published by Sangyo Times, a Japan-based publisher specializing in the electronics and semiconductor industries.

The award recognizes the development of a PFAS-free negative-type ArF immersion photoresist, a material developed with environmental considerations in mind that does not contain organic fluorine compounds. The product is used in advanced semiconductor manufacturing processes such as the manufacturing of AI semiconductors, for which demand continues to grow.

Fujifilm has been proactively working on the reduction and replacement of substances that pose potential risks to human health and the environment, while contributing to the advancement of the semiconductor industry by providing a one-stop solution to address customer needs.
In addition to the PFAS-Free negative-type ArF immersion photoresist that received the award, Fujifilm has also achieved PFAS-free development in products such as polyimide^*3 and the Wave Control Mosaic ^™*4 color filter materials for image sensors. Furthermore, in April 2026, Fujifilm developed the world’s first fluorine-free^*5 negative ArF immersion photoresist, which does not use fluorine-containing raw materials, not limited to PFAS.

Going forward, Fujifilm plans to promote development of PFAS free technologies to eliminate PFAS from all products both in front end and back end processes, in consideration of sustainability of the environment and ecosystems.

Fujifilm offers a wide range of materials used throughout the entire semiconductor manufacturing process, from front-end to back-end. These materials include photoresists, photolithography-related materials^*6, CMP slurries^*7, post-CMP cleaners^*8, thin-film materials^*9, photosensitive insulating materials such as polyimides under the ZEMATES^™*10 brand, and high-purity process chemicals^*11. Fujifilm also provides Wave Control Mosaic^™, a group of functional materials including color filter materials for image sensors.

With an extensive portfolio covering semiconductor manufacturing processes from leading-edge to legacy nodes, Fujifilm maintains a global supply chain with manufacturing and research and development sites in Asia, the United States, and Europe. By providing a one-stop solution to address customer needs, the company contributes to the advancement of the semiconductor industry.

• *1 PFAS refers to a collective term for perfluoroalkyl compounds, polyfluoroalkyl compounds, and their salts, as defined in the OECD's 2021 report “Reconciling Terminology of the Universe of Per- and Polyfluoroalkyl Substances: Recommendations and Practical Guidance.” Accordingly, the claim ‘PFAS-Free’ denotes the absence of substances falling within this defined group.
• *2 Photosensitive material used to coat a wafer substrate when circuit patterns are drawn using photochemical reactions in the process of semiconductor manufacturing.
• *3 A material with strong heat resistance and insulation properties, used for forming semiconductors’ protective films and rewiring layer.
• *4 General term referring to a group of functional materials for controlling electromagnetic light waves in a  broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones. WAVE CONTROL MOSAIC is a registered trademark or trademark of FUJIFILM Corporation.
• *5 Fluorine-free means that organic compounds containing carbon–fluorine bonds, including perfluoroalkyl compounds and polyfluoroalkyl compounds, are not used as raw materials.
• *6 Development solutions, cleaners and other materials used in the photolithography process of semiconductor
  manufacturing.
• *7 A proprietary formulation containing an abrasive that uniformly planarizes semiconductor surface, which contains a mixture of wires and insulation films of varying hardness.
• *8 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface.
• *9 Materials for forming low-dielectric insulation films.
• *10 ZEMATES is a registered trademark or trademark of FUJIFILM Corporation.
• *11 High-purity chemicals used in the cleaning and drying processes. The chemicals are employed to remove contaminants during the cleaning and drying stages of semiconductor manufacturing, as well as to eliminate metals and oils during the etching process.

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