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Aqueous post ash residue cleaners on aluminum and copper alloys, anti-reflective layers, SiO2 and low-k dielectrics
Highly effective aqueous post ash residue cleaners for both Al/SiO2 and Cu/low-k BEOL processes.
Applications include removing etch residues at via, metal line, and bond pad levels on Al alloys, anti-reflective layers, and SiO2 dielectrics or etch residue removal in damascene processes with Cu, low-k and ultra-low-k compatibility.
Contact Us for more information on the most suitable Fujifilm cleaner for your process needs
