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Home Business Semiconductor Materials CMP Slurries Buff Chemistries
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Buff Chemistries - Overview

Fujifilm Electronic Materials buff chemistries are designed to achieve particle-free, trace metal-free and organic-free for the advanced applications.

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  • Abrasive free buff chemistries on platen buff application
  • Excellent particles, trace metal and organic residue removal
  • Compatibility with existing slurries
  • Outstanding corrosion protection for sensitive metals
Product Lineup
  • MCN3200C
    • Buff / Pad cleaner for W and dielectric material application
    • Better organic residue and particle cleanability
    • Better cleanability for Tiny Particle in advance node process
  • MCN5900C
    • Abrasive-free on-platen buff cleaner tailored for advanced node cobalt applications
    • Effectively reduces defects generated during polishing, such as silica particles, organic residues, metal contaminants
    • Provides excellent cobalt protection with no risk of corrosion
    • Highly dilutable formulation for attractive cost of ownership
  • BCN8100C
    • On-platen buff cleaner designed for advanced node liner applications to reduce defectivity
    • Enhances cleaning efficiency for tiny silica particles
    • Effectively removes metal (Cu, Co, Ru) contaminations including metal ions, oxides and byproducts
    • Abrasive-free formulation with optional H₂O₂ addition
    • Highly dilutable formulation for attractive cost of ownership
  • BCN8200C
    • H₂O₂ -free on-platen buff cleaner and post-CMP cleaner (2-in-1) designed for advanced node BEOL applications to reduce defectivity
    • Provides excellent Cu/Co protection with no risk of corrosion
    • Effectively removes metal (Cu, Co, Ru) contaminations including metal ions, oxides and organic residue
    • Enhances cleaning efficiency for tiny silica particles
    • Highly dilutable formulation for attractive cost of ownership
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