Fujifilm Launches Pressure Measurement Film “Round Prescale”

TOKYO, June 8, 2026 – FUJIFILM Corporation announces the launch of “Round Prescale,” a circular type designed to match semiconductor wafer shapes for use in pressure inspection process. The product will be available as part of its “Prescale” ^*1 lineup starting June 8, 2026.

“Prescale,” in which Fujifilm holds a leading share of the global market, is a film that enables easy measurement of contact pressure, pressure balance, and pressure distribution between contacting surfaces. The film turns red when pressure is applied, allowing users to visually assess the magnitude of the pressure based on color density. As a result, “Prescale” is widely used in development and manufacturing processes across a wide range of industries, including displays, electronic components, automobiles, batteries, and packaging.

• Structure of “Prescale” (two-sheet type). When pressure is applied, the microcapsules in the color-forming layer, releasing the colorless dye they contain. When the dye comes into contact with the color developer, a chemical reaction occurs, causing the film to turn red.

Recently, in the semiconductor field, the importance of in-process pressure inspection has increased in line with the growing sophistication of manufacturing processes. As semiconductor miniaturization and stacking advance against the backdrop of the spread of AI and next-generation communications, demands for bonding accuracy and stability in the “wafer bonding” process—where wafers or chips are joined—are becoming increasingly stringent.  Even slight variations in pressure can affect semiconductor performance, creating a growing need for high-precision inspection of pressure uniformity during bonding.

Fujifilm has launched “Round Prescale” pressure measurement film, designed specifically for 12-inch (φ300 mm) wafers—the current industry standard in semiconductor manufacturing. Since the film does not need to be cut to match the size or shape of the wafer during inspection, it reduces both the time and labor required for inspection. Furthermore, “Round Prescale” supports pressure measurement at temperatures up to 220°C, enabling accurate measurement even when the equipment is heated to high temperatures.

In addition, “Round Prescale” is supported by Pressure Image Analysis App “FUJIFILM Prescale Mobile (Prescale Mobile)” ^*2 a mobile app that analyzes images captured from “Prescale” color images on mobile devices to quantify pressure.  Furthermore, Pressure Image Analysis System “FUJIFILM Prescale Station” (“Prescale Station”) ^*3, a system dedicated to “Prescale” that quantifies pressure by reading “Prescale” images with a high-resolution FA camera (Factory Automation Camera) is scheduled to support “Round Prescale” starting this July.

Fujifilm contributes to improving and stabilizing customers' manufacturing quality by developing and providing products that enable the digitalization and streamlining of inspection operations in development and manufacturing sites.

• *1 A film that utilizes Fujifilm’s precision coating technology and microcapsule technology to easily visualize the balance and distribution of pressure and surface pressure. Depending on the pressure being measured, “Prescale” comes in two types: a two-sheet type (a film in which the chromogen and developer are coated on separate substrates) and a single-sheet type (a film in which the chromogen and developer are coated on a single substrate). “Round Prescale” is only the two-sheet type.
• *2 A mobile application that quantifies pressure from the color-developed image of “Prescale” using Fujifilm’s advanced image processing technology. By placing the developed “Prescale” on a dedicated calibration sheet and scanning it with a mobile device installed with the app, users can easily obtain 13 types of pressure data such as maximum/minimum pressure, average pressure, and pressure area. This simple workflow enables anyone to perform high-precision pressure inspection with ease.
• *3 A dedicated pressure image analysis system that analyzes the color-changing image of “Prescale” to quantify pressure.

• *4 Recommended temperature for heating both sides of the contact surface

“Round Prescale” is designed to match the shape of 12-inch (φ300 mm) wafers, reducing the time and effort required for pressure measurement preparation. Furthermore, handling tabs allow users to handle the film without touching the pressure measurement surface, helping to improve work efficiency in semiconductor manufacturing environments.

1. Take “Round Prescale” out from the box.
2. Overlay A-film and C-film
3. Insert “Round Prescale” between the surfaces to be measured and apply pressure.
4. Visually confirm pressure using color charts and calibration curves.

The “Round Prescale” lineup includes models capable of pressure measurement in high-temperature environments ranging from 35 to 150°C and 150 to 220°C. Users can select the most suitable model based on their specific operating environment.

“Round Prescale” can also be captured by “Prescale Mobile“, which analyzes the color-developed images of “Prescale” to quantify pressure. With its simple workflow, users can easily quantify pressure, contributing to improved inspection efficiency and enhanced quality control. Additionally, “Prescale Station,” a dedicated pressure image analysis system for “Prescale,” is also scheduled to support “Round Prescale” starting this July.

• * Please note that the contents including the product availability, specification, prices and contacts in this website are current as of the date of the press announcement and may be subject to change without prior notice.