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Home Business Semiconductor Materials CMP Slurries Post CMP Cleaners
Metal Slurry in a beaker

Post CMP Cleaners

FUJIFILM Electronic Materials Post CMP slurries are designed to clean particles, trace metal and organic residues while protecting the metal surface.

Market-leading cleaner are available to meet a broad range process and technology requirements.

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  • Efficient particle removal
  • Excellent organic cleanability
  • Outstanding corrosion protection for sensitive metal features
  • Attractive cost of ownership – Concentrated cleaners provide lower cost at point-of-use
Product Lineup
  • Clean-100
    • Industrial Standard Cu-pCMP Cleaner
    • Acidic pH Platform
    • Low Cu SER
    • Good Cleanability for Particle and Organic residue
  • WCP-200
    • Industrial Standard W-pCMP Cleaner
    • Neutral pH Platform
    • Low W SER
    • Good Cleanability for Particle and Organic residue
  • FCN100XC
    • Designed as pCMP Cleaners for W, Mo and dielectric layers
    • Acidic pH Platform (FCN1003C)/ Neutral pH (FCN1006C) for better metal corrosion protection
    • Better Cleanability for Particle and Organic residue on Ox, SiN and poly-Si
    • Optimal cleaning bundling as on-platen buff chemistry and pCMP
  • FCN300XC
    • Designed as CIP of WCP-200, W-pCMP Cleaner. Also can be used for Mo application.
    • Neutral pH platform (FCN300C), Alkaline pH Platform (FCN3003C), Acidic pH Platform (FCN3004C)
    • Low W SER
    • Higher selectivity for WOx/W
    • Improved Particle and Organic residue removal
    • Enhanced cleanability for Tiny Particle in advance node process
    • Optimal results as on-platen buff chemistry and pCMP 2-in-1 applications
  • CCN9002C​​​​​​​
    • Designed as Advanced Cu-pCMP Cleaner
    • Alkaline pH Platform
    • Low Cu and Co SER
    • Used for Ru application
    • Good Cleanability for Particle and Organic residue
    • Designed for use on-platen buff chemistry and pCMP
  • CCN9005C​​​​​​​
    • Designed as Advanced Cu-pCMP Cleaner
    • Alkaline pH Platform
    • Low Cu and Co SER
    • Used for Ru application
    • Good Cleanability for Particle and Organic residue
    • Designed for use on-platen buff chemistry and pCMP
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