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Semiconductor Materials

Polyimides and PBO's

Non-Photosensitive

Non-Photosensitive - Overview

Materials for low shrinkage, low temperature and lift off applications

Fujifilm has several non-photosensitive polyimide formulations for a wide variety of semiconductor and related applications.

Product Lineup

Durimide™ 32A
- Fully imidized polyimide used primarily as junction coating, passivation and aligment layer. Low shrinkage and cure temperature, reworkable and solvent soluble
Durimide™ 116A
- Positive photoresist, solvent developable, 4-10 µm cured films
LTG 12-52
- Low temperature glue designed for die and component attach applications. Final thicknesses from 5 to 25 microns.

Features & Benefits

Final coating thicknesses from 1 to 25 microns
Low temperature cure options
Very low shrinkage
Patternable using laser direct imaging or etch methods
NMP free
* "Durimide™ " is a trademark of FUJIFILM CORPORATION, registered in the United States and other countries and regions.

Downloads

Non-photosensitive and Permanent glue materials [PDF]

Non-Photosensitive - Overview

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