United States

Semiconductor Materials


Aqueous post ash residue cleaners on aluminum and copper alloys, anti-reflective layers, SiO2 and low-k dielectrics

Manufacturing Chain
  • Removing etch residues at via, metal line, and bond pad levels on Al alloys, anti-reflective layers, and SiO2 dielectrics.
  • Etch residue removal in damascene processes with Cu, low-k and ultra low-k compatibility.