To polish and planarize complex layers of integrated circuits
CMP slurries are employed to polish and planarize complex layers of integrated circuits to customer specific requirements. FUJIFILM Electronic Materials offers variety of CMP slurries to support a broad range of technology nodes and process integration requirements, allowing our customers to achieve excellent product yields and reliability at a compelling cost of ownership.
Copper CMP Slurries
FUJIFILM Electronic Materials copper CMP slurries are designed to remove the copper overfill to expose underlying damascene interconnects.
Barrier CMP Slurries
FUJIFILM Electronic Materials barrier CMP slurries are designed to remove the barrier metals that are exposed following the copper clearing step as well as to planarize all films across the wafer surface.
Emerging Metal Slurries
FUJIFILM Electronic Materials Cobalt CMP slurries are designed to polish cobalt and barrier metals and planarize all films in the circuits during advanced Cobalt interconnect polish.
Front End CMP Slurries
FUJIFILM Electronic Materials Front End CMP slurries are designed for devices that utilize advanced transistor technologies such as high-K metal gates, advanced dielectrics, 3-dimensional FinFET transistors, and self-aligned contacts.