United States

Barrier CMP Slurries

NEW

FUJIFILM Electronic Materials barrier CMP slurries are designed to remove the barrier metals that are exposed following the copper clearing step as well as to planarize all films across the wafer surface.

Manufacturing Chain

FUJIFILM Electronic Materials barrier CMP slurries are designed to remove the barrier metals that are exposed following the copper clearing step as well as a portion of the inter-metal dielectric.